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Number of views:
1000
COF Flip Chip Bonder
Retail price
0.0
Yuan
Market price
0.0
Yuan
Number of views:
1000
Product serial number
Category
The Semi-Conductor Department
Quantity
-
+
1
Product Description
A fully automatic roll-to-roll flip-chip LCD/OLED driver chip binding device
|
Item |
Specfication |
|
Chip size |
W:1.5-5mm L:15-25mm T:0.2-1mm |
|
Tact time |
1.35-1.5sec |
|
Accuracy |
±1.5um |
|
Bond Force |
10-350N |
|
Heat(℃) |
Chip side: 200-450℃ Substrate: 100-150℃ |
|
Wafer Size |
8 inch and 12 inch |
|
Substrate size |
35/48/70mm 25-112um in thickness |
|
Bonding process |
Eutectic bonding |
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