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IC/COF & FPC bonding

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After clean the bonding circuit area,proceed IC/COF,FPC hot-press bonding
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Product Description

Product size:1~8"

COF punching accuracy:±50um

COF main bonding accuracy:±4um

IC main bonding accuracy:±4um

FPC main bonding accuracy:±10um

Tact time:3.5 seconds

Remark:automatic bonding for whole line, compatible for hard and soft dispalys, IC&COF bonder

We could not find any corresponding parameters, please add them to the properties table

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