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大尺寸PCB bonding点胶整线
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大尺寸PCB bonding点胶整线

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大尺寸PCB bonding以及Ag,UV,Tuffy点胶整线。
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Product Description

功能:大尺寸PCB bonding以及Ag,UV,Tuffy点胶整线

产品尺寸:21-60”

精度:Bonding : X±20um; X±40um  Dispenser: X/Y±100um;H±200um

Tact time:15秒

备注:取料→点Ag胶→PCB绑定(G) →点UV胶(G) →PCB绑定(S) →点UV胶(S) →出料

 

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