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FOB

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PCB hot-press bonding
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Product Description

Product size:21~58"((for reference,Customizable)

ACF lamination accuracy:X±150um;Y±100um

PCB main bonding accuracy:X±20um;Y±40um

Tact time:≤18 seconds(Base on PCB:2[S])

Process Flow:PCB Load+ACF lami.+ACF lami AOI+Main bonder

Remark:applicable to multilateral PCB bonder and customized design

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