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大尺寸PCB bonding点胶整线
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背光组装设备
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1
Product Description
功能:大尺寸PCB bonding以及Ag,UV,Tuffy点胶整线
产品尺寸:21-60”
精度:Bonding : X±20um; X±40um Dispenser: X/Y±100um;H±200um
Tact time:15秒
备注:取料→点Ag胶→PCB绑定(G) →点UV胶(G) →PCB绑定(S) →点UV胶(S) →出料
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3.5秒全自动背光组装机
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