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COF Flip Chip Die Bonder
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Yuan
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Yuan
Number of views:
1000
Product serial number
Category
Seml-Conductor
Quantity
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+
1
Product Description
Function: COF Flip Chip Die Bonder
Wafer size: 8"~12"
Substrate size: 35mm, 48mm, 70mm
Tact time: 1.5 sec.
Accuracy: ±1.5um
Bonding process : Eutectic
Application : Pick up the lC chip from the wafer, after the camera calibration, bond the lC chip on COF film
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