COF Flip Chip Die Bonder
Function: COF Flip Chip Die Bonder
Wafer size: 8"~12"
Substrate size: 35mm, 48mm, 70mm
Tact time: 1.5 sec.
Bonding process : Eutectic
Application : Pick up the lC chip from the wafer, after the camera calibration, bond the lC chip on COF film