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MiniLED Bonder

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Main feature: 1.MinilED bonder, for PCBand 6 inch wafer 2.Adopt the 6 bonding head with auto-alignment in software, can bond the RGB chip in the same substrate 3.Bonding head by use of the servo motor, and chip missing check by vacuum 4.Chip stage use the linear motor with angle alignment 5.Wafer ring can be automatically change
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The Semi-Conductor Department
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Product Description

Main feature:

1.MinilED bonder, for PCBand 6 inch wafer

2.Adopt the 6 bonding head with auto-alignment in software, can bond the RGB chip in the same substrate

3.Bonding head by use of the servo motor, and chip missing check by vacuum

4.Chip stage use the linear motor with angle alignment

5.Wafer ring can be automatically change

We could not find any corresponding parameters, please add them to the properties table
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