1/1
Number of views:
1000
Flip Chip Machine-CSP Bonding Machine
Retail price
0.0
Yuan
Market price
0.0
Yuan
Number of views:
1000
Product serial number
Category
The Semi-Conductor Department
Quantity
-
+
1
Product Description
The die-bonding machine DBD4600 is suitable for multi-module front-mounting and flip-mounting processes, with an accuracy of 25-35um.
|
Item |
Specification |
|
Chip size |
0.2-3.0mm |
|
Bond force |
0.3-3N |
|
Accuracy |
±25um |
|
Wafer size |
8/12 inch |
|
产能UPH |
8K |
Previous
COF Flip Chip Bonder