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Number of views:
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Bonding Machine-SOT Bonding Machine
Retail price
0.0
Yuan
Market price
0.0
Yuan
Number of views:
1000
Product serial number
Category
The Semi-Conductor Department
Quantity
-
+
1
Product Description
Bonding machine DBD4200, applicable to the SOT series, with an accuracy of ±30um. Other power products can also be made.
|
Item |
Specification |
|
Wafer size |
8” / 12” |
|
Chip sizes |
0.22 - 0.23 mm²to 1.5 x 1.5 mm² |
|
UPH |
12K |
|
Accuracy |
± 30µm |
|
Bonding force |
30 – 150 cN programmable |
|
Temperature |
100 to 450°C (programmable) |
Next
QFN Leadframe taping